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DATA SHEET
SKY77149 PA Module for CDMA / PCS (1850-1910 MHz)
Applications
* Personal Communications Services (PCS) * Wireless Local Loop (WLL) The SKY77149 System SmartTM Power Amplifier Module (PAM) is a fully matched 8-pin surface mount module developed for Code Division Multiple Access (CDMA) / Personal Communications Service (PCS) and Wireless Local Loop (WLL) applications. This small and efficient module packs full 1850-1910 MHz bandwidth coverage into a single compact package. The SKY77149 meets the stringent spectral linearity requirements of Code Division Multiple Access (CDMA) PCS transmission, with high power added efficiency for power output of up to 28 dBm. A low current pin (VCONT) is provided to improve efficiency for the low RF power range of operation. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. The output match is realized off-chip within the module package to optimize efficiency and power performance into a 50-ohm load. This device is manufactured with Skyworks' GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77149 is supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.
Features
* Low voltage positive bias supply - 3.2 V to 4.2 V * Low VREF - 2.85 V, nominal * Low IREF - less than 1 mA * Good linearity * High efficiency * Large dynamic range * 8-pin package - 3 x 3 x 1.2 mm * Power down control * Dynamic bias control * InGaP * IS95/CDMA2000/EVDO * Full U.S. PCS coverage
MODULE
VREF (1)
MMIC
Skyworks offers lead (Pb)-free "environmentally friendly" packaging that is RoHS compliant (European Parliament for the Restriction of Hazardous Substances).
VCONT (2) VCC2 (5) Driver Stage Bias VCC1 (4) RF_IN (3) GND (7, 8) Input Match DA Inter-Stage Match PA Output Match (6) RF_OUT Power Stage Bias
103062_001
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
103062B * Skyworks Proprietary and Confidential Information. * Products and product information are subject to change without notice. * November 6, 2006
1
DATA SHEET * SKY77149
PA MODULE FOR CDMA / PCS (1850-1910 MHz)
Electrical Specifications
The following tables list the electrical characteristics of the SKY77149 Power Amplifier. Table 1 lists the absolute maximum ratings, while Table 2 shows the recommended operating conditions to achieve the performance characteristics listed in Table 4. Table 3 presents a truth table for the power settings.
Table 1. Absolute Maximum Ratings 1
Parameter RF Input Power Supply Voltage Reference Voltage Control Voltage Case Temperature 2
1 2
Symbol PIN VCC VREF VCONT Operating TC Storage TSTG
Minimum -- -- -- -- -30 -55
Nominal 0 3.4 2.85 1.25 25 --
Maximum 5 6.0 3.0 3.0 +110 +125
Unit dBm Volts Volts Volts C
No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value. Case Operating Temperature refers to the temperature of the GROUND PAD at the underside of the package.
Table 2. Recommended Operating Conditions
Parameter Power Output Operating Frequency Supply Voltage Reference Voltage Control voltage Case Operating Temperature Symbol PO FO VCC VREF VCONT TC Minimum -- 1850.0 3.2 2.75 1.0 -30 Nominal -- 1880.0 3.4 2.85 1.25 +25 Maximum 28.0 1910.0 4.2 2.95 2.0 +85 Unit dBm MHz Volts Volts Volts C
Table 3. Power Range Truth Table 1
Power Setting High Power Low Power Shut Down
1
VREF 2.85 V 2.85 V 0.0 V
VCONT 2.0 V < 1.3 V 0.0 V
Output Power 28 dBm 0 dBm --
In the output power range between -10 dBm and +28 dBm, VCONT can be continuously adjusted to minimize current consumption while meeting required linearity specification.
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PA MODULE FOR CDMA / PCS (1850-1910 MHz)
DATA SHEET * SKY77149
Table 4. Electrical Specifications for CDMA Nominal Operating Conditions 1
Characteristics Symbol GLOW Gain conditions GMID GHIGH Gain Sensitivity Power Added Efficiency for Optimal VCONT Setting (VCC = 3.4 V) GSEN PAELOW PAEHIGH Total Supply current for Optimal VCONT Setting ICC_LOW ICC_HIGH Quiescent current Reference Current Control Current Total Supply current in Power-down Mode IQ_LOW IQ_HIGH IREF ICTRL IPD ACP1_LOW 1.25 MHz offset Adjacent Channel Power for Optimal VCONT Setting 2,3 ACP2_LOW 1.98 MHz offset VCONT = 2.0 V VCC = 3.4 V VREF = 0 V VCONT 1.3 V PO 0 dBm Condition VCONT 1.3 V PO < 0 dBm 1.3 V VCONT < 2.0 V PO = 16 dBm VCONT = 2.0 V PO = 28 dBm All conditions fixed, except VCONT PO = 0 dBm PO = 28 dBm PO = 0 dBm PO = 28 dBm VCONT = 1.25 V VCONT = 2.0 V 15 65 Minimum 19 23 26 5 0.5 37.0 Typical 22 26 28 8 0.7 40.0 40 450 35 95 0.5 100 2.0 -63.0 -50.0 -80.0 -55.0 -56.0 -45.0 PO 28 dBm -- -- 5:1 VSWR All phases PO 28 dBm PO = 29 dBm 10:1 5:1 -138.0 4.0 -- -- -- -- 40 5 40 5 s -- s 2.5:1 -70.0 60 500 47 130 1.5 250 5.0 -50.0 -48.0 dBc -60.0 -53.5 -35.0 -40.0 dBm/Hz dB -- dBc VSWR dBc mA A A mA mA Maximum 23 28 30 15 dB/Volt % dB Unit
ACP1_HIGH PO 28 dBm VCONT 1.3 V PO 0 dBm
ACP2_HIGH PO 28 dBm Harmonic Suppression Noise Power in RX Band 1930-1990 MHz Noise Figure Input Voltage Standing Wave Ratio (VSWR) Stability (Spurious output) Ruggedness 4 DC RF Turn Off Time 5
1 2 3
Second Third
FO2 FO3 RxBN NF VSWR S Ru TONDC TONRF TOFFDC TOFFRF
PO 28 dBm
Turn On Time 5
DC RF
Per Table 2 over dynamic range up to 28 dBm output power, unless otherwise specified ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. For CDMA2000 test configured as [PCH @ -3.75 dB, DCCH-9600 bps @ 0 dB; SCHO-9600 bps @ 0 dB] and other test configurations that yield a peak-to-average up to 4.5 dB for CCDF = 1%, up to 1. dB power back off from the maximum listed for IS95 may be required to meet specified maximum ACP performance under worst-case conditions. All phases, time = 10 seconds; VCC = 4.2 V; Freq. = 1850 MHz, 1880 MHz, 1910 MHz; TCASE = -30 C, +25 C, +85 C; PO set using 50 load, PIN held constant during mismatch. TONDC is time required to reach stable quiescent bias (10%) after VREF is switched high. TOFFDC is time required for battery to decrease to < 100 A after VREF is switched low. After ICQ is stable, The TONRF is time to reach final output power (1 dB) once RF input is applied. TOFFRF is time required for PO to drop 30 dB once RF input is removed.
4 5
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3
DATA SHEET * SKY77149
PA MODULE FOR CDMA / PCS (1850-1910 MHz)
Characterization Data
The following graphs illustrate the characteristics of a typical SKY77149 power amplifier designed for operation in the cellular frequency band (824-849 MHz). This amplifier was selected by characterizing a group of devices and then selecting a part with average electrical performance for both nominal and the full range of recommended operating conditions, including worst case limits. Figure 2 through 8 illustrate the digital signal characteristics of the SKY77149. Shown are power sweep characteristics for key performance parameters, over temperature and frequency, up to 28.5 dBm output power. The data was taken up to and including 8 dBm output power with the bias mode control pad setting of VCONT = 1.25 volts and from 10 dBm to 16 dBm output power with the bias mode control pad setting of VCONT = 1.55 V. Beyond 16 dBm output power, VCONT was set to 2.0 V.
31 29 27 25
Gain (dB)
23 VCONT = 2.0 V 21 19 VCONT = 1.25 V 17 15 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30
103062_002
VCONT = 1.55 V
Figure 2. Gain vs. Output Power
Legend 1850 MHz @ -30 C 1880 MHz @ -30 C 1910 MHz @ -30 C 1850 MHz @ +25 C 1880 MHz @ +25 C 1910 MHz @ +25 C 1850 MHz @ +85 C 1880 MHz @ +85 C 1910 MHz @ +85 C
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PA MODULE FOR CDMA / PCS (1850-1910 MHz)
DATA SHEET * SKY77149
800 700 600 VCONT = 2.0 V 500 VCONT = 1.55 V 400 300 200 100 0 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30
103062_003
ICC (mA)
VCONT = 1.25 V
Figure 3. Supply Current vs. Output Power
50 45 40 35 30
PAE (%)
25 20 15 10 5 0 0 2 4 6 8 10 12 14 VCONT = 1.25 V VCONT = 1.55 V
VCONT = 2.0 V
16 18 POUT (dBm)
20
22
24
26
28
30
103062_004
Figure 4. Power Added Efficiency vs. Output Power
Legend 1850 MHz @ -30 C 1880 MHz @ -30 C 1910 MHz @ -30 C 1850 MHz @ +25 C 1880 MHz @ +25 C 1910 MHz @ +25 C 1850 MHz @ +85 C 1880 MHz @ +85 C 1910 MHz @ +85 C
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5
DATA SHEET * SKY77149
PA MODULE FOR CDMA / PCS (1850-1910 MHz)
65 VCONT = 1.25 V 60 55 50 45 40 35 30 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30
103062_005
VCONT = 1.55 V
VCONT = 2.0 V
ACPR1
Figure 5. Adjacent Channel Power Ratio 1 vs. Output Power
85 VCONT = 1.25 V 80 75 70 VCONT = 1.55 V VCONT = 2.0 V
ACPR2 (dB)
65 60 55 50 45 40 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30
103062_006
Figure 6. Adjacent Channel Power Ratio 2 vs. Output Power
Legend 1850 MHz @ -30 C 1880 MHz @ -30 C 1910 MHz @ -30 C 1850 MHz @ +25 C 1880 MHz @ +25 C 1910 MHz @ +25 C 1850 MHz @ +85 C 1880 MHz @ +85 C 1910 MHz @ +85 C
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PA MODULE FOR CDMA / PCS (1850-1910 MHz)
DATA SHEET * SKY77149
64 62 60 58 56
VCONT = 1.25 V
VCONT = 1.55 V
VCONT = 2.0 V
2F0 (dB)
54 52 50 48 46 44 42 40 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30
103062_007
Figure 7. Second Harmonic vs. Output Power
65 60 VCONT = 1.25 V 55 50 45 40 35 VCONT = 1.55 V VCONT = 2.0 V
3F0 (dBc)
30 0 2 4 6 8 10 12 14 16 18 POUT (dBm) 20 22 24 26 28 30
103062_008
Figure 8. Third Harmonic vs. Output Power
Legend 1850 MHz @ -30 C 1880 MHz @ -30 C 1910 MHz @ -30 C 1850 MHz @ +25 C 1880 MHz @ +25 C 1910 MHz @ +25 C 1850 MHz @ +85 C 1880 MHz @ +85 C 1910 MHz @ +85 C
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
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7
DATA SHEET * SKY77149
PA MODULE FOR CDMA / PCS (1850-1910 MHz)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77149, the evaluation board schematic and diagrams are included for preliminary analysis and design. Figure 9 shows the basic schematic of the board for the 1850 MHz to 1910 MHz range.
VREF
C3 1000 pF
1
VREF
GND
8
VCONT RF_IN
C1 1000 pF
2
VCONT
GND
7 RF_OUT
3
RF_IN
RF_OUT
6
VCC1
C2 A 330 pF
4
VCC1
VCC2
5
A C6 330 pF C5 1000 pF C4 10 F
VCC2
A Place caps at closest proximity to PA module with the capacitor grounds directly connected to the PAM grounds.
103062_009
Figure 9. Evaluation Board Schematic
P1
RF_IN SKYWORKS SOLUTIONS, INC.
C2
1
J2
GND VCC1
C1
J1
GND
C3
VCONT GND
U1
VCC2 GND
C4
C5 C6
VREF
EN17 - D435 - 001 REV. 00
06/11/03 RF_OUT
COMPONENTS C1 1000 pF C2 330 pF C3 1000 pF C4 10 F C5 1000 pF C6 330 pF
103062_010
P2
Figure 10. Evaluation Board Assembly Diagram
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PA MODULE FOR CDMA / PCS (1850-1910 MHz)
DATA SHEET * SKY77149
Package Dimensions and Pin Descriptions
The SKY77149 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 11 is a mechanical drawing of the pad layout for this package and Figure 12 is a PCB Symbol diagram of the 3x3 mm SKY77149. Figure 13 shows the pin names and the pin numbering convention, which starts with pin 1 in the upper left and increments counter-clockwise around the package. Figure 14 illustrates typical case markings.
METAL PAD EDGES 0.05 A B C 2X 0.4 SOLDER MASK EDGES 0.1 A B C METAL PAD EDGES 0.05 A B C 0.1 SOLDER MASK EDGES 0.1 A B C
3 PIN 1 INDICATOR
B C
0.1 DETAIL A PAD SCALE: 2X 2X THIS ROTATION 2X ROTATED 180
3
0.1
2X 0.4 DETAIL B PAD SCALE: 2X THIS ROTATION ROTATED 90 CCW ROTATED 90 CW ROTATED 180
1X 1X 1X 1X
0.1 A B C
TOP VIEW
(1.35) 2X 1.325 2X 0.7 METAL PAD PIN 1
4X 0.4
(1.35)
A
B
4X 1.2 A
1.15 0.1
0.1 4X R0.2
SOLDER MASK OPENING 0.15 A B C
SIDE VIEW
ALL DIMENSIONS ARE IN MILLIMETERS.
BOTTOM VIEW
103062_011
Figure 11. SKY77149 Package Drawing
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9
DATA SHEET * SKY77149
PA MODULE FOR CDMA / PCS (1850-1910 MHz)
PCB SYMBOL FOR 3.0 x 3.0 mm PACKAGE CX77149 & CX77154 SPECIFIC 0.6 0.4 1.2 0.6 1.3
0.4 0.7
2.3
0.8 TYP
0.8 TYP
0.15
3.2
3.2 COMPONENT OUTLINE COMPONENT OUTLINE
STENCIL APERTURE
TOP VIEW APPROACH 1
STENCIL APERTURE
TOP VIEW APPROACH 2
0.6
COMMON GROUND PAD
COMPONENT OUTLINE
COMPONENT OUTLINE 0.7 4 X R0.5
0.4
0.5
0.05 ALL AROUND 0.25
2.55
0.8 TYP
0.8 TYP
0.25 3.2
METALLIZATION
TOP VIEW All dimensions are in millimeters.
Thermal Via Array O0.3 mm on 0.5 mm Pitch Additional Vias will improve thermal performance. NOTE: Thermal Vias Should be Tented and Filled with Solder Mask 30-35 m Cu Plating Recommended.
1.3 3.3
SOLDER MASK OPENING
TOP VIEW
103062_012
Figure 12. Phone PCB Layout Footprint Diagram for 3 x 3 mm, 8-Pin Package - SKY77149
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PA MODULE FOR CDMA / PCS (1850-1910 MHz)
DATA SHEET * SKY77149
VREF
1
8
GND
VCONT
2
7
GND
details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel Information - RF Modules, Document Number 101568.
RF_IN
3
6
RF_OUT
VCC1
4
GROUND PAD
5
VCC2
Electrostatic Discharge Sensitivity
The SKY77149 is a Class 2 device. Figure 15 lists the Electrostatic Discharge (ESD) immunity level for each non-ground pin of the SKY77149 product. The numbers in Figure 15 specify the ESD threshold level for each pin where the I-V curve between the pin and ground starts to show degradation. The ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pin, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization. Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards, which fail devices only after "the pin fails the electrical specification limits" or "the pin becomes completely nonfunctional". Skyworks employs most stringent criteria and fails devices as soon as the pin begins to show any degradation on a curve tracer.
Pad layout as seen from top view looking through the package. GROUND PAD is package underside. 103062_013
Figure 13. SKY77149 Pin Names and Configuration (Top View)
Pin 1 Identifier Lot Number Year of Manufacture Week Package Sealed
Part Number
77149-N XXXXX.X YYWW MX
Revision Number
Country Code
103062_014
Figure 14. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77149 is capable of withstanding an MSL3/250 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 C per second; maximum temperature should not exceed 250 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 250 C for more than 10 seconds. For
> + 2 kV < - 2 kV
VREF
1
8
GND
VCONT
> + 2 kV < - 2 kV
2
7
GND
RF_IN
> + 2 kV < - 2 kV
3
6
RF_OUT
> + 2 kV < - 2 kV
> + 2 kV < - 2 kV
VCC1
4
GROUND PAD
5
VCC2
> + 2 kV < - 2 kV
Pad layout as seen from top view looking through the package.
103062_015
Figure 15. ESD Sensitivity Areas (Top View)
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11
DATA SHEET * SKY77149
PA MODULE FOR CDMA / PCS (1850-1910 MHz)
To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD * Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges * Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors
handling precautions listed below.
* Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 to GND) * Protective Packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders
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Ordering Information
Model Number SKY77149 Manufacturing Part Number SKY77149 Product Revision Package 3x3LM-10 Operating Temperature -30 C to +85 C
Revision History
Revision A B Level Date May 8, 2006 November 6, 2006 Initial Release Revise: Table 4 Description
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Application Note: Tape and Reel Information - RF Modules, Document Number 101568 Standard SMT Reflow Profiles: JEDEC Standard J-STD-020
Copyright (c) 2003-2006, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks(R), the Skyworks logo, and Breakthrough Simplicity(R). Product names or services listed in this publication are for identification purposes only, and may be trademarks of Skyworks or other third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.

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